Shenzhen Helixin Electronic Equipment Co., Ltd.

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Our company sells brand new/Panasonic placement machines, placement machines, placement machines, Yamaha placement machines/ placement machines, Samsung placement machines/ placement machines Machine, Fuji SMT machine/SMT machine, Panasonic SMT machine/SMT machine, Siemens SMT machine/SMT machine, Sanyo SMT machine/SMT machine, semi-automatic printing machine, fully automatic printing machine Panasonic, Fuji Printing Machines, and other types of lead-free reflow soldering, lead-free reflow ovens, reflow soldering machines, soldering machines, wave ovens/lead-free wave ovens, docking stations, loading and unloading machines, wave soldering in and out board machines, reflow soldering, reflow ovens, Peripheral equipment

Panasonic placement machine product specifications Yang Sheng



Panasonic placement machine equipped with the latest features for high-quality placement

Equipped with the latest component support functions

Expands the component support range of conventional high-speed placement heads.

The newly developed universal mounting head (nozzle) can mount large components at high speed.

, Compatible with general-purpose transfer device

It can transfer the top kit, mounting solder, flux, etc. to the protruding parts with high precision, and has excellent versatility.

Excellent interchangeability with series products

The modular design concept ensures interchangeability with series products.

Continuity and evolution of expanded production

To expand production scale, only a small initial investment is needed to expand production in stages.

In addition, by developing the latest technological level accumulated in the series of products, only a small amount of investment is needed to realize the upgrade and evolution of the equipment after delivery.

Machine name

Model

Substrate size

High-speed placement head nozzle
< br/> Placement speed./chip(type)

Placement accuracy/chip(≧)

Component size chip*

Universal placement Mounting nozzle

Mounting speed./chip(type)

Mounting accuracy/chip

Component size chip* *

Multifunctional placement head nozzle

Placement speed. / (type)

Placement accuracy/ (≧)
< br/> Component size chip*



Substrate replacement time is approx. (When there are no components mounted on the back)

Three-phase power supply, , , , ,

Air pressure source* .,/ (.)

Equipment size* *

Weight*